While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the ...

Vapor compression cycles are predominantly used in air-conditioning, heat pump and refrigeration equipment. A good understanding of transient behaviors of vapor compression systems is critical to ...

Soil erosion is a key hydro-geological hazard and a primary cause of land degradation around the world, and it is increasing due to the combined pressures ...

Especially when it comes to manufacturing, problem-solving is an art. Every day, companies within this industry face challenges that test their processes, products and, ultimately, their bottom line.