USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.
As AI data centres continue to scale, token generation is limited by power availability, while efficiency is a defining factor for return on investment. Traditional architectures based on bulky, ...
Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...
Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...
Microchip Technology has launched a new range of 3.3 kV silicon carbide (SiC) power modules to support SST designs.
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
Interesting Engineering on MSN
Low-parasitic-inductance module cuts converter footprint for EVs and solar inverters
Engineers at the Department of Energy’s Oak Ridge National Laboratory have developed a new ...
Wolfspeed’s 3.3-kV SiC power modules target AI data centers, renewable energy systems, and grid infrastructure.
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...
Delivers industry’s fastest performance capability with 1-gamma DRAM and advanced packagingBOISE, Idaho, May 12, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced it has ...
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