The automotive industry stands at a crossroads entering 2026, facing a complex interplay of global tariffs, evolving electric vehicle (EV) dynamics, and the infusion of AI into just about everything.

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm. Some have announced specific plans at ...

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

Engineering considerations in multi-chiplet designs.

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

Achieving a deterministic “yes or no” answer in semiconductor verification is becoming more challenging as chip complexity increases. There are more cores, more potential interactions, and more ...