D-IC thermal management & KGD strategies; system-level engineering; within-wafer variability; image segmentation.
How to build an efficient and flexible multi-die system for edge AI.
Researchers from Ulsan National Institute of Science and Technology (UNIST) designed a biodegradable, energy efficient artificial synapse that uses a layered structure made from naturally-derived ...
Foundry-Enabled Patterning of Diamond Quantum Microchiplets for Scalable Quantum Photonics” was published by researchers at ...
Triggered Backdoors” was published by researchers at Berlin Institute for the Foundations of Learning and Data (BIFOLD), TU ...
Tightly coordinated data movement and low-latency on-chip storage for real-time environments.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Multi-die assemblies are the next phase of Moore’s Law, scaling up and out to improve performance and add flexibility into ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...
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