Abstract: A Ku-K dual-band antenna array is proposed for antenna-in-package beamforming applications, comprising eight subarrays integrated on an interposer board using ball-grid-array (BGA) packaging ...
Abstract: A novel antenna-in-package (AiP) of a 2-D array is proposed for sub-terahertz (Sub-THz) applications at the 250–310-GHz band. The 2-D array is decomposed into several 1-D row subarrays ...
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