Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Scientists from the RIKEN Center for Emergent Matter Science and colleagues have developed a new way to fabricate three-dimensional nanoscale devices from single-crystal materials using a focused ion ...

Quickly change the way a polygon model looks by adjusting its normals.

Anthropic has unveiled Claude Opus 4.6, introducing a million-token context window and automated agent coordination features ...

Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.